TYPICAL QUESTIONS WE ANSWER:
- What is the true cost?
- What are the major cost drivers?
- What is the trade-off between cost and risk?
- How can I lower costs?
- What is the risk vs. cost benefit for a new project or product?
- What is the expected return on investment (ROI)?
- How do the risks of a project impact costs and ROI?
EXAMPLE CONSULTING PROJECTS:
Click on the “Related Links” for more information
|Project Description||Company Description||Benefits||Related Links|
|Manage/execute Air Force MANTECH program||Defense contractor||Reduce cost of major ECM product|
|Consolidate/simplify product design||Defense electronics||Reduce parts & options counts, costs|
|Implementation of cost Of ownership analysis for electronic assembly industry. Adapting cost of ownership methodology for electronic assembly equipment||Electronic assembly equipment manufacturer||Understand true manufacturing cost||ACM Jun 1999, p.9|
|Cost analysis of test system and wafer prober combination||Equipment supplier||Combined COO|
|Cost analysis of 300mm manufacturing support tool||Equipment supplier||COO|
|Integrated analysis of cost of ownership for a new metrology inspection equipment and its impact throughout the fabrication process flow||Equipment supplier||Equipment performance impact to production||ACM Mar 1999, p.1|
|Review and assess equipment designs for quality, reliability, safety, manufacturability, and maintainability||Equipment supplier||Higher quality reliability, and safety; better maintainability and manufacturability; lower COO||Link to recommended book “Hi-tech Reliability”|
|Reliability predictions||Equipment supplier||Higher reliability; lower COO|
|Reliability test, planning and results analysis||Equipment supplier||Higher reliability; lower COO|
|Cost analysis impact of production test time to cost of ownership, good wafer throughput and OEE||Equipment supplier||Lower COO of test time|
|Created product costing models for three different flat panel display manufacturing technologies||FPD manufacturer||Strategic advantage|
|Forecast impacts of a new technology on the cost and profitability of a semiconductor wafer fab||Research & development organization||Validate continued R&D, establish marketing strategy||ACM Sep 2001, p.5|
|Cost of ownership analysis comparing equipment for new gate process||Semiconductor manufacturing||Equipment with lower COO|
|Cost of ownership analysis comparing new process and materials on photolithography||Semiconductor manufacturing||Justification of additional cost resulting in lower COO||ACM Fall 2005, p.1|
|Integrated supply chain evaluation of cost structures for commercialization of ChipSeal process from military application||Semiconductor materials supplier||Combined cost analysis|
|Comparison financial analysis to understand process cost impact of interlayer dielectric materials||Semiconductor materials supplier||Lower cost|
|Evaluation of cost of ownership for new CVD and CMP processes||Semiconductor materials supplier||Lower cost|
|Evaluated a passivation material and process technology for overall product cost inpact on semiconductor fabrication and final assembly||Semiconductor materials supplier||Lower cost|
|Comparison financial analysis to understand process cost impacts of planarization methods||Semiconductor materials supplier||Optimization||ACM Sep 1999, p.10|